NXP Posts 75 New Roles Across Global Sites
NXP Semiconductors added 75 new job openings across multiple sites and functions on Oct 12, 2026.
NXP Semiconductors announced 75 new job openings on Oct 12, 2026, spanning engineering, manufacturing and support roles across Asia, Europe and the Americas. The postings cover a broad mix of technical and professional roles at locations including Tianjin (Teda), Kuala Lumpur, Chandler, San Jose, Shanghai, Eindhoven, Pune, Toulouse, Milan, Bucharest, Noida, Bangkok, Hamburg, Austin, Sophia-Antipolis, Catania and Grenoble.
Representative examples include a 2027 Intern - AI Tool Development in Tianjin (Teda), a Senior Lead Design Engineer in Bangalore, and a Director, Advanced Power Silicon & Packaging Technology in Shanghai (JingAn), plus a Field Applications Engineer for Microcontrollers in San Jose. The listings also span manufacturing and support posts such as Semiconductor Assemblers and Equipment Technicians in Kuala Lumpur, and several intern and project roles in Chandler and Austin.
The broad spread across APAC, Europe and North America underscores NXP's ongoing talent expansion in automotive, AI, security and industrial systems.
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