Intel Adds 112 New Roles Across Global Sites
Intel expanded its hiring, adding 112 new positions across multiple countries to support ongoing chip design and manufacturing initiatives.
Intel announced a broad hiring push, adding 112 new roles across its global footprint, including the United States, Europe, Asia and beyond. The postings cover design, manufacturing, software, supply chain and safety functions, reflecting a wide talent strategy to support advanced process technologies and AI-enabled products.
Notable roles highlighted include SoC Design Verification Engineer in Santa Clara, Senior RF PCB Layout Engineer in Taipei, NM Silicon Photonics Lithography Process Development Engineer in Albuquerque, and 5G Telco Cloud/AI Software Engineer positions in Leixlip, Ireland, as well as Edge Agentic AI-focused roles in Riyadh, Saudi Arabia. The listings cover a mix of permanent roles and contract positions across sites such as Hillsboro, Penang, Shenzhen, and more, underscoring Intel's global recruitment scope.
Intel's postings signal ongoing investments in memory, edge AI, silicon photonics and advanced packaging, with a broad mix of engineering, software, and operations roles designed to support current and upcoming product initiatives.
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