Intel Expands Hiring with 65 New Roles
Intel added 65 new job openings across hardware, software, and operations worldwide, spanning the US, Europe, Asia, and Israel.
Intel issued 65 new postings across hardware, software, and operations, reflecting continued investment in product development and manufacturing. Highlights include the Silicon Packaging Design Architect role in Phoenix and the Senior Verification Engineer position in Leixlip, Ireland, along with AI Solution Architect internships in Hillsboro and Santa Clara.
Openings span multiple sites including Hillsboro, Phoenix, Bangalore, Penang, Gdansk, Haifa, and Munich, covering areas such as SoC design, packaging, software development, data science, and manufacturing quality. The postings show a broad pipeline across hardware design, software tooling, and supplier management.
The hiring wave signals Intel's focus on advanced packaging, AI, and neuromorphic computing, while also expanding opportunities for students and graduates through graduate and undergraduate internships and programs.
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