Intel Expands Hiring Across Global Sites

Intel announced 31 new job openings across its global footprint, spanning locations in the United States, Israel, Ireland, Malaysia, Poland and India. The postings cover senior business development, software and hardware engineering, manufacturing, and academic internships, with roles such as Senior Business Development Manager in Washington, D.C.; Ocotillo Technology Fabrication Emergency Response Equipment Technician in Phoenix, Arizona; and Azure Sales Account Manager - Virtual US. The company is filling roles across several campuses and remote postings, including Hillsboro, Oregon; Penang, Malaysia; Gdansk, Poland; Haifa and Kiryat Gat in Israel; and Albuquerque, New Mexico.

Among the openings are PhD internships in System Software Engineering and ISCP SoC Front End Team slated for 2027 in Hillsboro, Oregon, and a range of engineering tracks from Silicon/Electrical Validation to Physical Design. Other postings target manufacturing and packaging, including Advanced Packaging and Lithography Tool Install Engineer roles in Hillsboro, and a Software Development student slot in Haifa. The hiring push demonstrates Intel's ongoing investment in product development, manufacturing capabilities, and global customer support.