Intel Expands Global Hiring With 66 New Roles
Intel added 66 new roles across multiple countries, spanning AI, software, design, and manufacturing.
Intel's July 18, 2026 postings show a broad hiring drive with 66 new roles posted globally, spanning the United States, India, Vietnam, Malaysia, and elsewhere. The openings cover areas such as Foundry Solutions Business Development, software engineering, advanced packaging, manufacturing operations, and design roles.
Notable listings include Ocotillo Technology Fabrication roles in Phoenix, a Senior CPU Core Physical Design Engineer in Hillsboro, and AI Software Engineering Intern positions in Hillsboro and Phoenix. The slate also includes opportunities in Albuquerque (Advanced Packaging), Penang and Kulim in Malaysia, and Bangalore in India for packaging, process integration, and IP design.
It is a mixed batch of full-time, intern, and contract positions, underscoring Intel's ongoing investment in global talent to support its foundry, packaging, AI, and manufacturing initiatives.
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