Intel Adds 80 Global Roles Across Regions
Intel announced 80 new openings worldwide across design, manufacturing, and software roles.
Intel unveiled a global hiring push with 80 new openings across the Americas, Europe, and Asia-Pacific. Openings span hardware design, process engineering, packaging, IT, cloud software, and AI infrastructure, with postings in hubs such as Hillsboro (OR), Phoenix (AZ), Austin (TX), Bangalore (India), Penang (Malaysia), Haifa (Israel), Guadalajara (Mexico), and Santa Clara (CA).
Key focus areas include mixed-signal and CPU design, packaging development, silicon photonics, and related process development. The postings also cover IT project roles, software engineering, and internship opportunities, signaling a broad talent strategy to support both core silicon work and software-enabled platforms.
Intel’s global recruitment activity reflects ongoing investments in advanced manufacturing, foundry partnerships, and AI-enabled product development, with postings spanning Ireland, Israel, Vietnam, Ireland, Belgium, and beyond to broaden regional talent and accelerate product pipelines.
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