Intel Adds 30 Jobs Across Global Sites
Intel expanded its workforce with 30 new openings across engineering, finance, and IT roles in North America, Europe, and Asia-Pacific.
Intel announced 30 new job openings across its global footprint, spanning engineering, manufacturing, finance, and IT. Highlights include Mixed Signal Logic Design Engineer in Bangalore; Senior Testchip SoC Physical Design Engineer in Hillsboro, Oregon; Optical Sub-System Architect – Principal Engineer in Haifa; AI Research Engineer/Scientist in Santa Clara; Director, Global Network Operations in Phoenix; and Cloud Software Engineer in San Jose.
The postings also reflect roles in Penang, Malaysia, including multiple Accountant positions, a Manufacturing Quality and Reliability Engineer, and a Staff PDK Engineer for LVS/PERC development; and in other regions such as Ireland (Defect Equipment Systems Engineer) and South Korea (Foundry Product Engineer in Seoul).
This batch illustrates Intel's ongoing talent expansion across product design, manufacturing, and support functions to advance its chip and software initiatives.
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