Broadcom Expands Hiring Across Global Roles
Broadcom added 33 new positions worldwide across hardware, software, and R&D as of July 22, 2026.
Broadcom posted 33 new job openings across the globe, spanning hardware design, software development, R&D, and manufacturing. The listings include Physical Design Engineer, ASIC Implementation Engineer, Mfg Process/Procedure Tech 3, R&D Software Engineer, SerDes Application Engineer, and Product Marketing Engineer, with on-site roles in Colorado Springs; San Jose, Plano, Irvine, and Breinigsville; and international postings in Hyderabad, Singapore, Vienna, Cork, Regensburg, and other locations.
Several postings are designated as remote or hybrid, reflecting Broadcom's flexible hiring approach. Open roles cover the Americas, Europe, and Asia, including remote opportunities in Bulgaria and several U.S. locations. The postings illustrate Broadcom's ongoing investment in engineering, software quality, and product teams to support its broad range of chip and software solutions.
Taken together, the new openings signal continued growth in Broadcom’s R&D and manufacturing footprint in 2026.
Ready to make a move?
Explore 360 open roles at Broadcom
See live listings, salary signals, and apply in a click.
About this hiring signal
JobzMall monitors and summarizes publicly available career-page activity for job discovery. Company names and logos identify the employers discussed. Official career pages and job postings control availability and role details.