MEMS Packaging Design Engineer (Onsite)
Are you a highly skilled engineer with a passion for innovation and design? Are you looking for an exciting opportunity to join a dynamic team and contribute to cutting-edge technology? If so, Rockwell Collins has the perfect role for you! We are seeking a talented MEMS Packaging Design Engineer to join our onsite team and drive the development of next-generation microelectromechanical systems (MEMS) products. In this role, you will use your expertise in packaging design to ensure the reliability, functionality, and manufacturability of our MEMS devices. If you are a detail-oriented problem solver with a strong background in MEMS packaging design, we want to hear from you!
- Design and develop packaging solutions for new and existing MEMS products
- Ensure the reliability, functionality, and manufacturability of MEMS devices through packaging design
- Collaborate with cross-functional teams to identify and resolve packaging-related issues
- Conduct thorough analysis and testing of packaging designs to ensure performance and quality standards are met
- Develop and maintain packaging design guidelines and standards for the company
- Stay updated on industry trends and advancements in MEMS packaging technology
- Communicate and present packaging design concepts and recommendations to team members and stakeholders
- Work closely with manufacturing teams to ensure smooth transition from design to production
- Troubleshoot and provide solutions for packaging-related challenges during the development process
- Conduct feasibility studies and cost analysis for different packaging options
- Participate in design reviews and provide input for continuous improvement of packaging designs.
Bachelor's Degree In Mechanical Engineering, Electrical Engineering, Or Related Field.
Minimum Of 3-5 Years Of Experience In Mems Packaging Design And Development.
Knowledge Of Industry Standards And Regulations Related To Mems Packaging.
Proficiency In Cad Software For Design And Simulation, Such As Solidworks Or Ansys.
Strong Problem-Solving Skills And Ability To Work Collaboratively In A Team Environment.
Project Management
Failure Analysis
Quality Control
3D modeling
Reliability testing
Process development
Thermal management
Material Selection
Design Optimization
Microfabrication
Packaging Standards
Communication
Conflict Resolution
Emotional Intelligence
Leadership
Time management
creativity
Critical thinking
Teamwork
Adaptability
Problem-Solving
According to JobzMall, the average salary range for a MEMS Packaging Design Engineer (Onsite) in Burnsville, MN, USA is approximately $80,000 to $120,000 per year. However, this can vary depending on factors such as experience, education, and the specific company and industry the engineer is working in. Additionally, salaries for engineers in this field can also be affected by the current job market and demand for their skills.
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Rockwell Collins was a multinational corporation company headquartered in Cedar Rapids, Iowa providing avionics and information technology systems and services to government agencies and aircraft manufacturers.
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