Nokia

Silicon Photonics Packaging Engineer Co-op

Nokia

United States
Full-TimeDepends on ExperienceSenior LevelMasters
Job Description

Nokia is seeking a highly motivated and skilled individual to join our team as a Silicon Photonics Packaging Engineer Co-op. In this role, you will have the opportunity to work alongside experienced professionals in a dynamic and innovative environment, contributing to the development of cutting-edge technology in the field of photonics. We are looking for a candidate with a strong background in packaging and assembly of photonic devices, as well as a passion for problem-solving and a desire to learn and grow. If you are driven, detail-oriented, and eager to make an impact in the world of photonics, we encourage you to apply for this exciting opportunity.

  1. Collaborate with a team of experienced professionals to develop and optimize packaging solutions for silicon photonic devices.
  2. Conduct research and development to improve packaging processes and techniques, with a focus on efficiency and cost-effectiveness.
  3. Design and execute experiments to validate packaging designs and ensure high-quality and reliable products.
  4. Troubleshoot and resolve any issues related to packaging and assembly of photonic devices.
  5. Communicate and collaborate with cross-functional teams including design, process, and quality engineers to ensure successful integration of packaging solutions.
  6. Maintain accurate documentation of packaging processes and procedures.
  7. Stay abreast of industry developments and advancements in silicon photonics packaging, and incorporate new techniques and technologies into the packaging process.
  8. Follow safety protocols and maintain a clean and organized work environment.
  9. Continuously strive for process improvement and optimization to increase efficiency and reduce costs.
  10. Participate in team meetings and provide regular updates on project progress and challenges.
Where is this job?
This job is located at United States
Job Qualifications
  • Ability To Work Independently And In A Team Environment, With Excellent Communication And Problem-Solving Skills.

  • Bachelor's Or Master's Degree In Electrical Engineering, Optics, Or Related Field

  • Strong Understanding Of Photonics Principles And Experience With Silicon Photonics Packaging Techniques

  • Proficiency In Cad Software (Such As Autocad Or Solidworks) For Designing Packaging Solutions

  • Experience With Testing And Characterization Of Photonic Components And Systems

Required Skills
  • Quality Control

  • 3D Printing

  • Product Testing

  • CAD software

  • Packaging design

  • material characterization

  • Thermal management

  • Laser Alignment

  • Microfabrication

  • Integrated Circuits

  • Optical Communication

Soft Skills
  • Communication

  • Conflict Resolution

  • Emotional Intelligence

  • Leadership

  • Time management

  • creativity

  • Attention to detail

  • Teamwork

  • Adaptability

  • Problem-Solving

Compensation

According to JobzMall, the average salary range for a Silicon Photonics Packaging Engineer Co-op in United States is $60,000 to $80,000 per year. However, this can vary depending on the specific company, location, and level of experience. Some companies may also offer additional benefits such as housing or transportation allowances for co-op positions.

Additional Information
Nokia is an Equal Opportunity Employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. We do not discriminate based upon race, religion, color, national origin, sex, sexual orientation, gender identity, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics.
Required LanguagesEnglish
Job PostedOctober 13th, 2025
Apply BeforeJune 9th, 2026
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About Nokia

Nokia Corporation is a Finnish multinational telecommunications, information technology, and consumer electronics company, founded in 1865.

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