Microelectronics Packaging Engineer

At Boeing, we believe that innovation is the key to customer satisfaction. We are looking for a Microelectronics Packaging Engineer who is passionate about creating high-performance products and driving industry-leading solutions. As a Microelectronics Packaging Engineer, you will use your strong technical background and creative problem solving to advance our product development efforts.The ideal candidate will have a Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science or a related field. You should possess excellent communication and interpersonal skills and have experience with microelectronics design and packaging processes. A strong understanding of materials, physics and electrical engineering principles is also essential. The ability to work both independently and in a team environment is essential. If you have a passion for developing innovative products and exceeding customer expectations, we invite you to join the team at Boeing.

According to JobzMall, the average salary range for a Microelectronics Packaging Engineer in Huntington Beach, CA, USA is $86,000 - $117,000. This range is dependent on factors such as experience, education, and industry.

The Boeing Company, commonly known as Boeing, is an American multinational corporation that designs, manufactures, and sells airplanes, rotorcraft, rockets, satellites, telecommunications equipment, and missiles worldwide. The company also provides leasing and product support services.