NXP Semiconductors

2024-2025 Pre-assembly Process Innovation Engineer Intern

NXP Semiconductors

Bangkok, Thailand
Full-TimeDepends on ExperienceMid-LevelBachelors
Job Description

Welcome to NXP Semiconductors, a leading semiconductor company dedicated to driving innovation and shaping the future of technology. We are currently seeking a highly motivated and passionate individual to join our team as a Pre-assembly Process Innovation Engineer Intern for the 2024-2025 term. As an intern, you will have the opportunity to work alongside experienced professionals and contribute to cutting-edge projects that will shape the future of our industry. We are looking for individuals who are eager to learn, driven to succeed, and have a strong passion for innovation. If you are ready to challenge yourself and be a part of a dynamic and forward-thinking team, we encourage you to apply for this exciting opportunity.

  1. Assist in the development and implementation of new pre-assembly processes and technologies to improve efficiency and quality.
  2. Conduct research and analysis to identify potential areas for process improvement and cost reduction.
  3. Collaborate with cross-functional teams to gather feedback and make recommendations for process enhancements.
  4. Develop and maintain detailed documentation of process changes and improvements.
  5. Perform testing and validation of new processes and equipment to ensure they meet quality standards.
  6. Monitor and analyze process data to identify trends and areas for improvement.
  7. Participate in meetings and presentations to share updates and progress on process innovation projects.
  8. Learn and adhere to all safety and compliance regulations related to pre-assembly processes.
  9. Stay up-to-date on industry advancements and technology to bring fresh ideas and insights to the team.
  10. Utilize problem-solving skills to troubleshoot and resolve any issues that may arise during process development and implementation.
  11. Provide support and assistance to other team members as needed.
  12. Embrace a continuous learning mindset and actively seek out opportunities for growth and development.
Where is this job?
This job is located at Bangkok, Thailand
Job Qualifications
  • Bachelor's Degree In Electrical Engineering, Computer Science, Or A Related Field.

  • Strong Problem-Solving And Analytical Skills.

  • Excellent Communication And Teamwork Abilities.

  • Knowledge Of Semiconductor Manufacturing Processes And Equipment.

  • Experience With Process Improvement Methodologies, Such As Six Sigma Or Lean.

Required Skills
  • Process Improvement

  • Project Management

  • Data Analysis

  • Communication

  • Time Management

  • Technical Writing

  • Quality Control

  • Critical Thinking

  • Design Thinking

  • Root Cause Analysis

  • Teamwork

  • Problem-Solving

Soft Skills
  • Communication

  • Conflict Resolution

  • Leadership

  • Time management

  • creativity

  • Attention to detail

  • Teamwork

  • Active Listening

  • Adaptability

  • Problem-Solving

Compensation

According to JobzMall, the average salary range for a 2024-2025 Pre-assembly Process Innovation Engineer Intern in Bangkok, Thailand is approximately ฿15,000-฿25,000 per month. However, this can vary depending on the specific company, industry, and individual qualifications and experience.

Additional Information
NXP Semiconductors is an Equal Opportunity Employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. We do not discriminate based upon race, religion, color, national origin, sex, sexual orientation, gender identity, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics.
Required LanguagesThai
Job PostedMarch 27th, 2025
Apply BeforeMay 22nd, 2025
This job posting is from a verified source. 

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About NXP Semiconductors

NXP Semiconductors Inc. is an Dutch semiconductor manufacturer, engages in the provision of secure connectivity solutions for embedded applications. It operates through the High Performance Mixed Signal and Standard Products segments. The High Performance Mixed Signal segment delivers high performance mixed signal solutions to customers to satisfy their system and sub-system needs across eight application areas: automotive, identification, mobile, consumer, computing, wireless infrastructure, lighting, and industrial.

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