
Packaging Development Engineer
Are you a creative problem-solver with a passion for technology? Do you thrive in a fast-paced environment and enjoy collaborating with a team to bring innovative products to life? If so, we have an exciting opportunity for you at NVIDIA! We are seeking a talented Packaging Development Engineer to join our team and help drive the design and development of cutting-edge packaging solutions for our industry-leading products. In this role, you will work closely with cross-functional teams to ensure that our packaging meets the highest standards of quality, performance, and reliability. If you are a self-motivated individual with a strong background in packaging engineering and a drive for excellence, we encourage you to apply for this position and become a part of our dynamic and innovative team at NVIDIA.
- Collaborate with cross-functional teams to develop innovative packaging solutions for NVIDIA products.
- Design and develop packaging prototypes and conduct thorough testing to ensure quality, performance, and reliability.
- Conduct research and stay updated on industry trends and advancements in packaging technologies.
- Identify and troubleshoot packaging issues, and provide timely and effective solutions.
- Work closely with suppliers and manufacturers to ensure packaging materials and processes meet NVIDIA's standards and specifications.
- Develop and maintain packaging design guidelines and standards.
- Ensure compliance with all relevant regulations and standards for packaging materials and processes.
- Manage packaging development timelines and budgets.
- Communicate progress, challenges, and recommendations to stakeholders and management.
- Continuously seek opportunities to improve packaging efficiency, cost-effectiveness, and sustainability.
- Mentor and train junior packaging engineers.
- Represent NVIDIA in external meetings and conferences related to packaging development.
- Maintain documentation and records related to packaging development processes and specifications.
- Adhere to all safety protocols and guidelines in the design and development of packaging solutions.
- Demonstrate a strong understanding of NVIDIA's products and their packaging requirements.
Bachelor's Degree In Mechanical Engineering, Packaging Engineering, Or A Related Field.
Minimum Of 3 Years Of Experience In Packaging Development, Preferably In The Semiconductor Or Electronics Industry.
Proficiency In Computer-Aided Design (Cad) Software, Such As Solidworks Or Autocad.
Strong Understanding Of Packaging Materials And Manufacturing Processes, Including Experience With Advanced Packaging Technologies Such As Flip-Chip And Multi-Chip Modules.
Excellent Problem-Solving Skills And Ability To Work Cross-Functionally With Teams In Product Design, Manufacturing, And Quality Assurance.
Project Management
Supply Chain Management
Prototyping
Cost Analysis
Quality Control
CAD software
Packaging design
Packaging Testing
Materials Selection
Design For Manufacturability
Sustainable Packaging
Communication
Conflict Resolution
Emotional Intelligence
Leadership
Time management
creativity
Critical thinking
Teamwork
Adaptability
Problem-Solving
According to JobzMall, the average salary range for a Packaging Development Engineer in Santa Clara, CA, USA is $80,000 - $120,000 per year. This range may vary depending on the specific industry, company, and level of experience of the individual. Factors such as education level, certifications, and additional skills may also impact the salary range.
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NVIDIA Corp. designs and manufactures computer graphics processors, chipsets, and related multimedia software. The company operates through two segments: Graphics Processing Unit and Tegra Processor. The Graphics Processing Unit segment includes sales of the company's GeForce discrete and chipset products that supports desktop and notebook PCs plus license fees from Intel and sales of memory products. The Tegra Processors segment provides processors that deliver superior visual and multimedia experience on tablets, smart phones and gaming devices while consuming minimal power.

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