Principal Electronics Packaging Engineer

Linthicum Heights, MD, USA

Full-TimeDepends on ExperienceSenior LevelMasters

Job Description

Welcome to Northrop Grumman, a leading aerospace and defense company dedicated to pushing the boundaries of innovation and technology. We are seeking a highly skilled and motivated Principal Electronics Packaging Engineer to join our dynamic team. Our ideal candidate is a creative problem solver with a strong background in electronics packaging design and development. In this role, you will have the opportunity to lead and contribute to cutting-edge projects that will shape the future of our industry. If you are passionate about pushing the limits of what is possible and thrive in a fast-paced environment, we encourage you to apply for this exciting opportunity.

Lead and contribute to the design and development of electronics packaging for cutting-edge projects.
Utilize creativity and problem-solving skills to develop innovative packaging solutions.
Collaborate with a dynamic team to push the boundaries of innovation and technology.
Apply a strong background in electronics packaging design to meet project requirements and industry standards.
Ensure that all packaging designs meet performance, reliability, and cost targets.
Conduct thorough research and analysis to identify and evaluate new packaging technologies.
Develop and maintain design documentation, including specifications, drawings, and test plans.
Communicate effectively with cross-functional teams to ensure successful project execution.
Stay up-to-date with industry trends and advancements in electronics packaging.
Mentor and provide guidance to junior engineers on packaging design best practices.
Take ownership of projects and drive them to successful completion.
Adhere to company policies and procedures, including safety protocols.
Represent the company and its values in a professional manner at all times.
Continuously strive for improvement and contribute to the overall success of the company.

Where is this job?

This job is located at Linthicum Heights, MD, USA

Job Qualifications

Bachelor's Degree In Electrical Engineering, Mechanical Engineering, Or A Related Field
Minimum Of 8 Years Of Experience In Electronics Packaging Design And Development
Proficiency In Cad Software, Such As Autocad Or Solidworks, For Creating And Modifying Electronic Packaging Designs
Strong Understanding Of Industry Standards And Best Practices For Electronics Packaging, Including Thermal Management, Shock And Vibration Resistance, And Emi/Rfi Shielding
Experience In Leading A Team And Managing Complex Projects, With Excellent Communication And Problem-Solving Skills.

Required Skills

Project Management
Failure Analysis
Reliability testing
Circuit Design
PCB Layout
Cost reduction
Supplier management
Mechanical Engineering
Thermal management
Material Selection
Dfm (Design For Manufacturing

Soft Skills

Communication
Conflict Resolution
Leadership
Time management
Interpersonal Skills
creativity
Critical thinking
Teamwork
Adaptability
Problem-Solving

Compensation

According to JobzMall, the average salary range for a Principal Electronics Packaging Engineer in Linthicum Heights, MD, USA is $110,000-$150,000 per year. This may vary depending on factors such as experience, education, and industry.

Additional Information

Northrop Grumman is an Equal Opportunity Employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. We do not discriminate based upon race, religion, color, national origin, sex, sexual orientation, gender identity, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics.

Required LanguagesEnglish

Job PostedSeptember 27th, 2024

Apply BeforeMay 22nd, 2025

This job posting is from a verified source.

Reposted

See an issue with this job? Report it to us