Micron Technology

Sr. Advanced Packaging Process Engineer

Micron Technology
Boise, ID, USA
Full-TimeDepends on ExperienceSenior LevelPhd or Professional
Job Description

At Micron Technology, we are looking for a highly experienced Senior Advanced Packaging Process Engineer to join our team. This individual will be responsible for developing advanced packaging process technologies and capabilities that enable the adoption of next-generation memory products. This is a great opportunity for an experienced engineer to join an innovative and forward-thinking team. We are looking for someone with a strong background in semiconductor processing and the ability to think outside the box to develop creative solutions to complex engineering challenges.We require a Bachelor’s Degree in Electrical Engineering, Chemistry, Materials Science, Physics, or related field and 10+ years of experience in semiconductor processing, packaging technology, and/or related areas. Expertise in advanced packaging processing technologies such as 3D stacking, wafer bonding, and solder bumping is desired. The ideal candidate will be able to work independently and collaboratively in a cross-functional team environment with excellent communication and problem-solving skills.

Where is this job?
This job is located at Boise, ID, USA
Job Qualifications

  • Bachelor's Degree In Electrical Engineering

  • Mechanical Engineering

  • Materials Science

  • Or Related Discipline

  • Minimum Of Years Of Experience In Semiconductor Processing

  • Knowledge Of Advanced Packaging Technologies Such As ./D-Ic

  • Wlcsp

  • Flip Chip

  • And Embedded Die Technologies

  • Experience In Developing And Optimizing Process Flows And Driving Continuous Improvement

  • Experience In Troubleshooting

  • Problem Solving And Root Cause Analysis

  • Ability To Work With

Required Skills

  • Risk Management

  • Quality Assurance

  • Troubleshooting

  • Data Analysis

  • Automation

  • Process Engineering

  • Process optimization

  • Manufacturing

  • Process documentation

  • Process Control

  • CAD design

  • Cost Optimization

  • Design Validation

  • Engineering Design

  • Packaging Engineering

Soft Skills

  • Communication

  • Conflict Resolution

  • Leadership

  • Problem Solving

  • Time management

  • Interpersonal Skills

  • flexibility

  • Creative Thinking

  • Teamwork

  • Adaptability

Compensation

According to JobzMall, the average salary range for a Sr. Advanced Packaging Process Engineer in Boise, ID, USA is between $126,000 and $150,000 per year. This range is based on salaries submitted by employers and job seekers from the area. The salary range may vary slightly depending on the qualifications, experience and market conditions.

Additional Information
Micron Technology is an Equal Opportunity Employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. We do not discriminate based upon race, religion, color, national origin, sex, sexual orientation, gender identity, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics.
Required LanguagesEnglish
Job PostedApril 26th, 2023
Apply BeforeAugust 19th, 2025
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About Micron Technology

Micron Technology, Inc. is an American producer of computer memory and computer data storage including dynamic random-access memory, flash memory, and USB flash drives. It is headquartered in Boise, Idaho. Its consumer products are marketed under the brands Crucial and Ballistix.

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