Micron Technology

Senior Manager/ Manager, Advanced Packaging Technology Development - Assembly Engineering

Micron Technology

Singapore
Full-TimeDepends on ExperienceSenior LevelMasters
Job Description

Are you a visionary leader with a passion for developing cutting-edge packaging technology? Do you thrive in a fast-paced, dynamic environment? If so, we have an exciting opportunity for you at Micron Technology. As the Senior Manager/Manager of Advanced Packaging Technology Development in our Assembly Engineering team, you will play a crucial role in driving the development of innovative packaging solutions for our advanced memory products. We are seeking a highly skilled and experienced individual with a strong background in assembly engineering and a proven track record of successfully leading and managing teams. If you are ready to take on a challenging and rewarding role in shaping the future of packaging technology, we want to hear from you!

  • Lead and manage a team of engineers in the development of cutting-edge packaging technology for advanced memory products at Micron Technology
  • Develop and implement strategic plans for advancing packaging technology and staying ahead of industry trends and competition
  • Collaborate with cross-functional teams to ensure alignment and integration of packaging technology with overall product development strategy
  • Conduct research and evaluation of emerging packaging technologies and identify opportunities for their application in Micron's products
  • Oversee the design, development, and testing of new packaging solutions, ensuring they meet performance, cost, and reliability requirements
  • Manage project timelines and budgets, ensuring timely delivery of high-quality packaging technology solutions
  • Provide technical expertise and guidance to the team, fostering a culture of innovation and continuous improvement
  • Stay updated on industry developments and best practices, and proactively identify opportunities for process and technology improvements
  • Evaluate and select external partners and vendors for collaboration in packaging technology development
  • Represent Micron in industry conferences and events, and build relationships with key stakeholders and partners in the packaging technology field.
Where is this job?
This job is located at Singapore
Job Qualifications
  • Extensive Experience In Advanced Packaging Technology Development: The Ideal Candidate Should Have A Strong Background And Expertise In Advanced Packaging Technologies Such As 2.5D/3D Packaging, Fan-Out Wafer-Level Packaging, And Interconnect Technologies.

  • Technical Leadership: The Candidate Should Have A Proven Track Record Of Leading Cross-Functional Teams In The Development And Implementation Of New Packaging Technologies. This Includes The Ability To Drive Projects From Concept To Production And Deliver Results Within Tight Timelines.

  • Strong Understanding Of Assembly Engineering: The Candidate Should Have A Deep Understanding Of Assembly Processes And Equipment, Including Wire Bonding, Flip-Chip, Encapsulation, And Testing. This Knowledge Will Be Essential In Driving Process Improvements And Optimizing Yield And Quality.

  • Innovative Mindset: The Candidate Should Be Able To Think Outside The Box And Come Up With Creative Solutions To Technical Challenges. This Includes The Ability To Identify New Packaging Technologies And Processes That Can Drive Cost Reduction And Improve Performance.

  • Project Management Skills: The Candidate Should Be Highly Organized And Have Excellent Project Management Skills. This Includes The Ability To Manage Multiple Projects Simultaneously, Prioritize Tasks, And Effectively Communicate Project Status And Risks To Stakeholders.

Required Skills
  • Strategic Planning

  • Project Management

  • Supply Chain Management

  • Problem Solving

  • Quality Control

  • Team Building

  • Technical Leadership

  • Process optimization

  • Cost reduction

  • Innovation

  • Cross-Functional Collaboration

Soft Skills
  • Communication

  • Conflict Resolution

  • Leadership

  • Time management

  • Teamwork

  • Active Listening

  • Adaptability

  • Problem-Solving

  • Empathy

  • Decision-making

Compensation

According to JobzMall, the average salary range for a Senior Manager/ Manager, Advanced Packaging Technology Development - Assembly Engineering in Singapore is between $9,000 to $12,500 per month. This could vary depending on factors such as experience, qualifications, and the specific industry or company the individual is working for. Additionally, bonuses, benefits, and other forms of compensation may also play a role in the overall salary package for this position.

Additional Information
Micron Technology is an Equal Opportunity Employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. We do not discriminate based upon race, religion, color, national origin, sex, sexual orientation, gender identity, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics.
Required LanguagesEnglish
Job PostedApril 16th, 2025
Apply BeforeJune 21st, 2025
This job posting is from a verified source. 

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About Micron Technology

Micron Technology, Inc. is an American producer of computer memory and computer data storage including dynamic random-access memory, flash memory, and USB flash drives. It is headquartered in Boise, Idaho. Its consumer products are marketed under the brands Crucial and Ballistix.

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