Silicon Packaging Engineer

We are looking for a highly motivated and experienced Silicon Packaging Engineer to join the Intel team. The ideal candidate will have a passion for pushing the boundaries of current technology and a strong sense of teamwork. The successful applicant will be responsible for developing packaging solutions for Intel’s silicon products, from concept to production.To be successful in this role, you should have a degree in electrical engineering, or a related field, and at least three years of experience in semiconductor packaging engineering. Additionally, you should have a solid understanding of semiconductor fabrication processes, semiconductor package assembly processes, and knowledge of material properties. You should have excellent communication skills and be able to work collaboratively with other departments. Finally, you should be comfortable working independently and in a fast-paced environment.If you are ready to take on this challenging and rewarding role, we would love to hear from you!

Responsibilities:

1. Design and develop packaging solutions for Intel’s silicon products from concept to production.
2. Ensure product performance, reliability, and quality.
3. Utilize knowledge of semiconductor fabrication processes, semiconductor package assembly processes, and material properties.
4. Collaborate with other departments to ensure proper execution of product.
5. Maintain accuracy and timeliness of daily tasks.
6. Keep up with industry trends and new technologies.
7. Keep detailed records of all projects.
8. Monitor and troubleshoot production issues.
9. Manage resources to ensure cost effectiveness.
10. Establish and maintain effective working relationships with colleagues.

According to JobzMall, the average salary range for a Silicon Packaging Engineer in Bengaluru, Karnataka, India is between ₹5,00,000 and ₹13,00,000 per year.

Intel Corp. engages in the design, manufacture, and sale of computer products and technologies. It delivers computer, networking, and communications platforms. It operates its business through the following segments: Client Computing Group, Data Center Group, Internet of Things Group, Non-Volatile Memory Solutions Group, Intel Security Group, and Programmable Solutions.