Intel

Photonics Senior Packaging and Assembly Engineer

Intel

Phoenix, AZ, USA
Full-TimeDepends on ExperienceSenior LevelMasters
Job Description

We are looking for an experienced and enthusiastic Photonics Senior Packaging and Assembly Engineer to join Intel’s team. This is an opportunity to join a team of world-class professionals and to use your photonics expertise to make an impact on cutting-edge technologies.To be successful in this role, you will need a strong technical background and experience in photonics packaging and assembly. You should also have excellent problem-solving, communication, and decision-making skills. The ideal candidate should be self-directed, highly motivated, and able to work in a fast-paced environment.If you’re excited to make your mark on the future of photonics and Intel, please apply today!

Responsibilities:

  1. Utilize technical expertise in photonics packaging and assembly to develop and execute innovative solutions
  2. Research and develop new photonics technologies to drive forward Intel's projects
  3. Troubleshoot and resolve any issues related to photonics packaging and assembly
  4. Document and report progress and results to team members and supervisors
  5. Work with other departments to ensure efficient production and quality assurance
  6. Ensure compliance with all safety and industry standards
  7. Stay up-to-date with the latest developments in photonics technologies and processes
  8. Collaborate with team members to achieve desired results
  9. Provide leadership and mentorship to junior team members
  10. Support the organization's goals and objectives through effective communication and problem-solving skills
Where is this job?
This job is located at Phoenix, AZ, USA
Job Qualifications
  • Bs Degree In Electrical/Mechanical Engineering

  • + Years Of Experience In Packaging & Assembly In A Semiconductor/Electronics Environment

  • Proficient In D Cad Tools

  • Knowledge Of Optics & Optical Components

  • Working Experience In A Clean Room Environment

  • Knowledge Of Electrical Test & Measurement Equipment

  • Ability To Read & Interpret Technical Drawings & Documents

  • Excellent Problem Solving & Communication Skills

Required Skills
  • Documentation

  • Testing

  • Troubleshooting

  • Communication

  • Quality

  • Management

  • Automation

  • Packaging

  • Fabrication

  • Assembly

  • Soldering

  • Wiring

  • Inspection

  • Connectivity

  • Optical

Soft Skills
  • Communication

  • Leadership

  • Time management

  • Interpersonal Skills

  • creativity

  • Organization

  • self-motivation

  • Teamwork

  • Adaptability

  • Problem-Solving

Compensation

According to JobzMall, the average salary range for a Photonics Senior Packaging and Assembly Engineer in Phoenix, AZ, USA is $81,000 to $106,000 per year.

Additional Information
Intel is an Equal Opportunity Employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. We do not discriminate based upon race, religion, color, national origin, sex, sexual orientation, gender identity, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics.
Required LanguagesEnglish
Job PostedMay 25th, 2023
Apply BeforeMay 22nd, 2025
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About Intel

Intel Corp. engages in the design, manufacture, and sale of computer products and technologies. It delivers computer, networking, and communications platforms. It operates its business through the following segments: Client Computing Group, Data Center Group, Internet of Things Group, Non-Volatile Memory Solutions Group, Intel Security Group, and Programmable Solutions.

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