Packaging R&D Engineer Graduate Intern

We are looking for an eager and motivated Packaging R&D Engineer Graduate Intern to join Intel's Research and Development team. Intel's R&D team pushes the boundaries of innovation, creating solutions that keep up with the ever-changing technology landscape. As a Packaging R&D Engineer Graduate Intern, you will have the opportunity to develop new packaging solutions and technologies to help Intel continue to be a leader in the semiconductor industry.This internship requires a combination of technical and creative skills, as well as the ability to work both independently and in a team environment. We are seeking a candidate who has a strong understanding of packaging materials, processes, and design principles, as well as critical thinking and problem-solving skills. The ideal candidate must have a Bachelor's or Master's degree in Packaging Engineering, Materials Science, or a related field, and be able to demonstrate strong knowledge in the areas of packaging design and development. The successful candidate will possess a passion for pushing the boundaries of technology and have the desire to work on innovative projects.

Responsibilities:

1. Develop new packaging solutions and technologies to keep Intel at the forefront of the semiconductor industry.
2. Utilize a combination of technical and creative skills to complete projects.
3. Collaborate with team members to brainstorm and execute ideas.
4. Utilize knowledge of packaging design, materials, processes, and design principles to develop new solutions.
5. Demonstrate strong critical thinking and problem-solving skills.
6. Participate in research activities and experiments related to packaging design.
7. Monitor and analyze trends in the semiconductor industry.
8. Document research findings and results.
9. Stay abreast of the latest developments in the field of packaging engineering.

According to JobzMall, the average salary range for a Packaging R&D Engineer Graduate Intern in Phoenix, AZ, USA is $30,000 to $45,000 per year. This range is based on salary data from various sources, including employers, recruiters, and job search websites. Generally, the salary range for a Packaging R&D Engineer Graduate Intern in Phoenix, AZ, USA is determined by factors such as the employer’s size, location, and industry, as well as the individual’s experience and qualifications.

Intel Corp. engages in the design, manufacture, and sale of computer products and technologies. It delivers computer, networking, and communications platforms. It operates its business through the following segments: Client Computing Group, Data Center Group, Internet of Things Group, Non-Volatile Memory Solutions Group, Intel Security Group, and Programmable Solutions.