3D-IC STCO Physical Design Intern
Welcome to Intel's 3D-IC STCO Physical Design Internship program! We are seeking highly motivated individuals to join our team and gain hands-on experience in the exciting world of 3D-IC design. As an intern, you will have the opportunity to work alongside our experienced professionals and contribute to cutting-edge projects. We are looking for candidates who are passionate about technology, eager to learn, and have a strong foundation in physical design concepts. If you are ready to take on new challenges and be a part of a dynamic team, we encourage you to apply for this internship.
- Assist in the development and implementation of 3D-IC physical design projects.
- Collaborate with team members to gather requirements and create design plans.
- Conduct research and analyze data to support design decisions.
- Utilize software and tools to create physical designs and simulations.
- Work closely with experienced professionals to gain hands-on experience and learn new skills.
- Participate in team meetings and provide updates on project progress.
- Follow company guidelines and processes to ensure high-quality and efficient design work.
- Continuously strive to improve knowledge and skills related to 3D-IC design.
- Communicate effectively with team members and superiors to discuss ideas and troubleshoot issues.
- Adhere to project timelines and deliver work within designated deadlines.
- Maintain accurate and organized documentation of design processes and results.
- Contribute to a positive and collaborative work environment.
- Demonstrate a strong understanding of physical design concepts and their application.
- Take ownership of tasks and show initiative in identifying and solving problems.
- Represent Intel professionally and uphold the company's values and standards.
Strong Understanding Of Physical Design Principles: Candidates Should Have A Solid Understanding Of Physical Design Concepts Such As Floorplanning, Placement, Routing, And Timing Closure.
Familiarity With 3D-Ic Design: Experience With 3D-Ic Design And Technologies, Such As Through-Silicon Vias (Tsvs) And Interposer Design, Is Highly Desirable.
Proficiency In Cad Tools: Candidates Should Be Proficient In Using Industry-Standard Cad Tools For Physical Design, Such As Cadence Innovus, Synopsys Icc, Or Mentor Graphics Olympus-Soc.
Knowledge Of Advanced Packaging Techniques: Familiarity With Advanced Packaging Techniques, Such As Flip-Chip And Wafer-Level Packaging, Is A Plus.
Strong Problem-Solving Skills: The Ability To Identify And Solve Complex Design Challenges Is Crucial For Success In This Role. Candidates Should Be Able To Demonstrate Their Problem-Solving Skills Through Previous Projects Or Coursework.
Power Distribution
Layout Design
Package Design
Thermal Analysis
Circuit Simulation
Signal Integrity
Floorplanning
Interconnect Design
3D-Ic Architecture
Chip-Level Integration
Communication
Conflict Resolution
Emotional Intelligence
Leadership
Time management
creativity
Teamwork
Active Listening
Adaptability
Problem-Solving
According to JobzMall, the average salary range for a 3D-IC STCO Physical Design Intern in Santa Clara, CA, USA is between $87,000 and $91,000 per year. This may vary depending on the specific company, experience level, and skills of the individual. Some factors that can affect salary include the location, industry, and demand for the role.
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Intel Corp. engages in the design, manufacture, and sale of computer products and technologies. It delivers computer, networking, and communications platforms. It operates its business through the following segments: Client Computing Group, Data Center Group, Internet of Things Group, Non-Volatile Memory Solutions Group, Intel Security Group, and Programmable Solutions.
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