IC Package Mechanical FEA Engineer (R&D)

Welcome to Broadcom, a leading global provider of semiconductor solutions for wired and wireless communications. We are currently seeking a highly skilled and motivated IC Package Mechanical FEA Engineer to join our R&D team. In this role, you will be responsible for performing mechanical FEA (Finite Element Analysis) simulations and analyses for our advanced integrated circuit packages. To excel in this position, you must have a strong background in mechanical engineering, with a focus on FEA and packaging design. You should also be adept at working with a variety of software tools and have a keen attention to detail. As part of our team, you will have the opportunity to work on cutting-edge technologies and contribute to the development of our innovative products. If you are passionate about pushing the boundaries of engineering and making an impact in the semiconductor industry, we invite you to apply for this exciting opportunity at Broadcom.

1. Conduct mechanical FEA (Finite Element Analysis) simulations and analyses for advanced integrated circuit packages.
2. Collaborate with cross-functional teams to develop and optimize packaging designs.
3. Utilize various software tools to perform FEA simulations and analyze results.
4. Provide technical expertise and support to other engineers and teams within the organization.
5. Ensure accuracy and correctness of FEA simulations and analyses.
6. Stay updated on industry trends and advancements in FEA and packaging design.
7. Identify and troubleshoot potential issues in packaging designs.
8. Communicate and present findings and recommendations to stakeholders and team members.
9. Contribute to the development and improvement of FEA processes and methodologies.
10. Adhere to project timelines and deliver results within designated timelines.
11. Maintain detailed documentation of FEA simulations and analyses.
12. Collaborate with external partners and vendors to optimize packaging designs.
13. Participate in design reviews and provide constructive feedback.
14. Ensure compliance with company and industry standards and regulations.
15. Continuously strive for innovation and improvement in FEA processes and techniques.

According to JobzMall, the average salary range for a IC Package Mechanical FEA Engineer (R&D) in Fort Collins, CO, USA is $95,000 to $130,000 per year. This may vary depending on the specific company, industry, and level of experience of the engineer. Some companies may offer higher salaries or additional benefits such as bonuses, stock options, and healthcare benefits. It is also important to consider the cost of living in Fort Collins, as this can affect the overall salary package.

Broadcom Inc. is an American designer, developer, manufacturer and global supplier of a wide range of semiconductor and infrastructure software products, Broadcom's product portfolio serves the data center, networking, software, broadband, wireless, and storage and industrial markets.