IC Packaging Engineer

Drive productization end to end from package concept to NPI, HVM, project running packaging aspects to meet cost/manufacturability, signal integrity, package design, Flip Chip assembly, CPI, mechanical/thermal requirements. Work with chip design, product engineering, development and manufacturing teams, to recommend the optimum package solutions to meet program schedules, component and system level performance expectations. Interface closely with assembly manufacturing and material partners, to develop and bring up new packaging technology from definition to prototyping and mass production. Execute and coordinate Flip Chip packages in single chip, MCM, and 2.5D/3D in material optimization, manufacturability process characterization, NPI, CPI, package qualifications of component and board level, failure analysis, and thermal/mechanical interactions, with strong problem solving skills. Support and collaborate with business units and customers for product execution and alignments.

According to JobzMall, the average salary range for a IC Packaging Engineer in 7171 Southwest Pkwy, Austin, TX 78735, USA is $80,000 - $90,000 per year. This range can vary depending on experience, education, and other qualifications.

Advanced Micro Devices, Inc. is an American multinational semiconductor company based in Santa Clara, California that develops computer processors and related technologies for business and consumer markets..