AMD

Electronics Packaging High Speed IO Technology Lead

AMD
Austin, TX, USA
Full-TimeDepends on ExperienceSenior LevelMasters
Job Description

Welcome to AMD, a world-renowned technology company at the forefront of innovation and advancement in the electronics industry. We are currently seeking a highly skilled and experienced Electronics Packaging High Speed IO Technology Lead to join our dynamic team of experts.As the Electronics Packaging High Speed IO Technology Lead, you will play a crucial role in driving the development and implementation of cutting-edge high-speed IO technology for our advanced packaging solutions. You will collaborate with cross-functional teams to design, develop, and optimize high-speed IO interfaces, ensuring our products meet the ever-evolving demands of the market.To excel in this role, you must have a strong background in electronics packaging and demonstrate a deep understanding of high-speed IO technology. Your passion for pushing the boundaries of technology and your ability to think outside the box will make you an invaluable asset to our team. Join us and be part of the exciting journey towards shaping the future of electronics packaging.

  1. Lead the development and implementation of high-speed IO technology for advanced packaging solutions.
  2. Collaborate with cross-functional teams to design, develop, and optimize high-speed IO interfaces.
  3. Stay up-to-date with industry trends and advancements in high-speed IO technology.
  4. Conduct research and analysis to identify potential opportunities for improvement in high-speed IO technology.
  5. Develop and maintain relationships with external partners and vendors to support the development and implementation of high-speed IO technology.
  6. Provide technical guidance and support to team members and colleagues.
  7. Ensure that all high-speed IO technology solutions meet industry standards and regulations.
  8. Develop and execute testing protocols to ensure the reliability and functionality of high-speed IO interfaces.
  9. Troubleshoot and resolve any issues related to high-speed IO technology.
  10. Monitor and analyze data to identify areas for improvement and implement necessary changes.
  11. Communicate progress and updates to team members and stakeholders.
  12. Foster a culture of innovation and continuous improvement within the team.
  13. Stay organized and prioritize tasks to meet project deadlines and goals.
  14. Demonstrate a strong understanding of electronics packaging and its impact on high-speed IO technology.
  15. Continuously seek opportunities to push the boundaries of technology and contribute to the advancement of the industry.
Where is this job?
This job is located at Austin, TX, USA
Job Qualifications

  • Advanced Knowledge Of High-Speed Io Technologies: The Candidate Should Possess In-Depth Knowledge And Understanding Of High-Speed Io Technologies Such As Pcie, Usb, Thunderbolt, And Ethernet, And Their Implementation In Electronic Packaging.

  • Experience In Signal And Power Integrity Analysis: A Strong Background In Signal And Power Integrity Analysis Is Essential For This Role, As The Candidate Will Be Responsible For Ensuring The High-Speed Io Signals Are Transmitted Accurately And Reliably In The System.

  • Proficiency In Electronic Packaging Design Tools: The Candidate Should Be Proficient In Using Electronic Packaging Design Tools Such As Cadence Allegro, Mentor Graphics Hyperlynx, And Ansys Hfss For Layout, Simulation, And Analysis Of High-Speed Io Interfaces.

  • Knowledge Of Industry Standards And Protocols: The Candidate Should Be Familiar With Industry Standards And Protocols Related To High-Speed Io Interfaces, Such As Pcie Gen 4/5, Usb 3.2/4.0 And Ethernet 10/25/100/400G.

  • Leadership And Project Management Skills: As A Technology Lead, The Candidate Should Have Strong Leadership And Project Management Skills To Effectively Oversee And Guide A Team Of Engineers In The Development Of High-Speed Io Technologies For Electronic Packaging.

Required Skills

  • PCB design

  • Signal Integrity

  • System integration

  • Thermal management

  • Interconnect Design

  • Technology Leadership

  • Power Delivery

  • Electromagnetic Compatibility (Emc)

  • Electronics Packaging

  • High Speed Io

Soft Skills

  • Communication

  • Conflict Resolution

  • Emotional Intelligence

  • Leadership

  • Time management

  • creativity

  • Critical thinking

  • Teamwork

  • Adaptability

  • Problem-Solving

Compensation

According to JobzMall, the average salary range for a Electronics Packaging High Speed IO Technology Lead in Austin, TX, USA is $120,000 - $160,000 per year. However, salaries can vary based on experience, qualifications, and company size. Some companies may offer additional benefits and bonuses as well.

Additional Information
AMD is an Equal Opportunity Employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. We do not discriminate based upon race, religion, color, national origin, sex, sexual orientation, gender identity, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics.
Required LanguagesEnglish
Job PostedJuly 24th, 2024
Apply BeforeApril 11th, 2026
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About AMD

Advanced Micro Devices, Inc. is an American multinational semiconductor company based in Santa Clara, California that develops computer processors and related technologies for business and consumer markets..

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